Share your real-world experiences using Siemens EDA tools with our global user community and connect with industry experts who are on the leading edge of digital transformation.
The User2User Speaker Program
Submission dates and timeline
Submit your abstract in the following technical areas to have a chance to become part of our vibrant community:
Technical areas
3DIC / Chiplet Package Design
Aprisa Digital IC Implementation
Calibre Design Solutions & Power Integrity Analysis
Custom IC Verification
Functional Design & Verification
Hardware-Assisted Verification
High-Level Synthesis/Verification & RTL Power Estimation/Optimization
Package / PCB Analysis & Verification
Tessent Test Solutions and Embedded Analytics
Timeline
February 16 | Submission deadline
February 29 | Speaker acceptance notifications
March 15 | Provide speaker information (bio, picture, name, role, email)
March 18 | Signed marketing agreement is due
March 18 | Speaker registration deadline
March 28 | Final pdf presentation is due (North America)