Siemens EDA visionaries take the stage to explore breakthrough technologies shaping the future of electronic design. These thought leadership panels examine emerging trends, real‑world impact, and bold ideas redefining how the industry innovates and scales.
User2User Thought Leadership unites industry experts to explore the challenges and opportunities shaping tomorrow’s technology. Through sessions on 3D IC, AI in EDA, and Connected verification, learn from leaders driving the next wave of innovation.
Learn: Deepen your understanding of emerging EDA technologies
Connect: Exchange ideas with the minds shaping the industry
Grow: Transform insight into innovation
Explore how Siemens EDA AI—from ML to agentic AI—boosts productivity and quality across the full EDA workflow, with the Fuse EDA AI System and Fuse EDA AI Agent enabling fully autonomous semiconductor and PCB design.
This panel examines the impact of a rapidly expanding 3D IC supply chain and new technology options while exploring the pros & cons of interface standards to enable D2D interoperability in an open marketplace.
As AI/ML SoCs grow more complex, first‑silicon success declines. This panel explores connected verification—from simulation to emulation—combining accelerated engines, expert insight, and AI‑driven innovation to improve outcomes.