Best Presentation Award

Best Presentation Award

The Best Presentation Award celebrates Siemens EDA customers who demonstrate our commitment to addressing today’s challenges and driving innovation for the future.

Eligibility

• Open to any Siemens EDA customer presenting at User2User North America or User2User Europe.

Voting Process

• Attendees will vote onsite for their favorite presentations after the final track session.
• Voting will remain open for 30 minutes.
• The top three presentations in each region will receive awards, based on a formula that normalizes session attendance. In the event of a tie, the steering committee will review onsite.

Award Announcement & Prizes

• Winners will be announced during the final networking event at each event.
• Awards will be granted via VISA gift card and mailed after the event to allow for accounting and eligibility confirmation.
• Each winner will also receive a certificate onsite.

Award Amounts

• 1st Place: $500
• 2nd Place: $250
• 3rd Place: $150

Important Note
Award recipients are responsible for ensuring acceptance complies with their organization’s policies.

Previous Best Presentation Award Winners

Congratulations to the 2026 User2User North America Best Presentation award winners.

1st Place - Tsavorite: Enabling formal verification at scale: An agentic AI-driven approach to RTL bring-up, documentation, and property creation and verification
Nirmala Balakrishnan, Tsavorite Scalable Intelligence
Kanur Aneja Khayam, Siemens

2nd Place - Microsoft: Multi-die SSN architecture using source-synchronous timing for high-speed test delivery
Brian Griesbach, Microsoft
Kathy Yang, Siemens

3rd Place - Microchip: Building flexibility, agility, and automation into a complete Aprisa flow
lRTL-to-GDS digital implementation
Scott Krueger, Microchip
Alejandro Hernandez, Microchip
Sindhu Pilli, Siemens

Congratulations to the 2026 User2User Europe Best Presentation award winners.

1st Place: Intel: Shift-left enablement of cutting-edge technologies using Veloce StratoPlus – iSolve PCIe-6 solution
Rotem Levy, Intel
Yoram Grinberg, Intel
Andy Meier, Siemens

2nd Place: STMicroelectronics: Early tiling methodology using SmartFill and RTC-Fill on ST SmartPower layouts
Fabrizio Messina, STMicroelectronics
Martina Cadeddu, STMicroelectronics
Cristian Mazzoni, Siemens

3rd Place: The new Tessent Shell-Based CellModelGen framework: Increased automation & reduced efforts for library defect characterization
Manu Baby, Infineon
Arne Sticht, Siemens

Thank you to all presenters. We look forward to 2027 conference submissions for both User2User North America and User2User Europe.