User2User North America

Speaker: Mike Ellow

The rapid evolution of Software-Defined-Systems has fundamentally reshaped the landscape of electronics development, with software architecture now driving hardware. This change in approach presents a range of challenges for electronic development organizations, including scaling limitations, multi-domain design and optimization, and the complex task of maintaining data links across various levels of IC and system integration. Compounding these challenges is the attrition of the engineering workforce and the scarcity of new talent.

To effectively address these obstacles, organizations must adopt comprehensive strategies encompassing production-grade AI, efficient requirements capture and modeling, and methodologies that facilitate seamless software/hardware co-design. As chip-level scaling reaches constraints, the integration of chiplets and 3D IC design workflows becomes critical. The management of cross-domain data within the silicon lifecycle context requires integration with broader platforms while gaining domain-specific insights. Furthermore, establishing strategic partnerships with foundries and service providers is pivotal for ensuring a responsive software-driven design process.

This presentation will feature Mike Ellow, CEO of Siemens EDA, who will highlight Siemens' groundbreaking approach to reinventing digital twins for EDA. By leveraging the most comprehensive digital twin for electronic systems, organizations can achieve agility in the face of the challenges and opportunities of System-Driven-Systems Aware.

Speaker: Sandeep Bharathi

Today’s AI clusters are the most sophisticated, most complex technological marvels the world has ever seen. In this world, the unit of computing power is no longer the processor. Rather, it is an entire system of processors interconnected by a dense, high-bandwidth fabric. To continue to advance the state of the art in AI, designers must evolve from pure chip design to end-to-end system design, inclusive of on-package integrated optics or copper. This talk will address the multi-tiered complexity of AI infrastructure design and the opportunity for EDA tools to use this AI infrastructure in the service enabling a scalable system-level design process.

Speaker: Mohit Gupta

Chiplet technology is redefining how the semiconductor industry approaches performance, scalability, and efficiency. As AI continues to drive demand for custom, high-throughput compute solutions, chiplet-based architectures offer a compelling path forward—enabling faster integration of specialized logic, memory, and connectivity within a single package.

This keynote will explore the role of chiplets in accelerating AI innovation, even as first time silicon success becomes increasingly challenged, and how proven silicon IP subsystems paired with robust verification is reducing time-to-market, and optimizing power and performance for advanced workloads.It will also touch on the growing relevance of chiplets across high-performance computing, 6G, and data center infrastructure. Customization is key because different applications call for different optimization priorities e.g. LLM Training calls for lowest possible latency but 6G calls for different priority mix. With a focus on connectivity as a key enabler, Alphawave Semi will highlight key areas where it is helping shape the future of compute through its chiplet platforms, silicon IP, and optical interconnect technologies.

"Alphawave Semi is shaping the future of AI through a modular and scalable approach to compute. By integrating advanced silicon IP, custom silicon, and high-speed optical connectivity, we’re enabling the next era of AI infrastructure—built on the power and flexibility of chiplets."