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User2User content library

Access content from the User2User event series, which brings together the electronic design automation (EDA) community to share their real-world experiences using Siemens EDA Tools.

User2User 2026 general sessions, keynotes & panels

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General sessions & keynotes

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NVIDIA: Accelerated computing & agentic AI in EDA

Da Yang, NVIDIA

Explore how agentic AI and GPU-accelerated tools like Siemens Fuse transform chip design. Join NVIDIA and Siemens to see how AI-driven workflows and accelerated computing empower engineers to shorten timelines and innovate.

User2User North America

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Accelerating chip development with AWS cloud

Nafea Bshara, Amazon Web Services

Tackle semiconductor design complexity & TTM demands with cloud-native EDA. Discover how AWS Graviton processors redefine EDA economics, accelerate verification, and mitigate risks for strategic competitive advantage.

User2User North America

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Siemens EDA leadership perspectives

Siemens Leadership w/ Jodi Shelton, GSA

Unpack the future of EDA with Siemens EDA executive leadership. Discover how AI-native platforms, software-defined design, and silicon innovation drive productivity and accelerate complex projects.

User2User North America

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Arm: Redefining silicon for the AI era

Karima Dridi, Arm

Explore how AI-driven workloads transform the silicon design lifecycle, from architecture to system integration. Discover new methodologies, ecosystem collaboration, and software enablement for success.

User2User Europe

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AI & solver acceleration for engineering workflow

Dr. John Linford, NVIDIA

Explore how accelerated computing, AI physics models, & agentic AI (Siemens Fuse EDA AI) shorten iteration cycles. Discover interactive loops for richer design space exploration in complex systems.

User2User Europe

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Siemens EDA leadership perspective

Siemens leaders w/ Silicon Catalyst EU

Join executive leadership in a roundtable to explore software-defined architectures, AI as a design partner, and silicon's evolution. Navigate design complexity and compressed time-to-market.

User2User Europe

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AI-powered autonomous workflows with Siemens EDA

Sathishkumar Balasubramanian, Siemens

Explore how Siemens EDA AI—from ML to agentic AI—boosts productivity and quality across the full EDA workflow, with the Fuse EDA AI System and Fuse EDA AI Agent enabling fully autonomous semiconductor and PCB design.

User2User Europe

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European wrap up & best presentation awards

G Lee, S Ahnen, JM Saint-Paul, Siemens

Unpack key European tech trends! User2User reveals booming semiconductor sector, AI advancements, and significant investments in manufacturing, aerospace, & quantum computing. Siemens commits to 100 fabless startups.

User2User Europe

User2User 2026 technical breakout sessions

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3D IC design and verification

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GF: Enhance the accuracy of 3D-xACT for F2F 3D IC

Jignesh Patel, GlobalFoundries

Master face-to-face bonded 3D ICs! This presentation details a new flow with Calibre 3D-xACT for generating detailed interface parasitics, crucial for AMS/RF co-optimization and accurate characterization in advanced designs.

User2User North America

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Marvell: Physical verification strategies for 3D IC

Qi Wang and Mohannad Alshawi, Marvell

Tackle 2.5D/3D IC physical verification challenges from heterogeneous tech & multi-foundry integration. Discover a scalable methodology with hierarchical flows, automation, and enhanced rule checks for robust signoff.

User2User North America

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Intel: 3D IC physical verif flow utilizing 3Dblox

Intel

Streamline 3D IC physical verification! This session presents a scalable, automated LVS methodology for multi-foundry chiplets, using 3dblox & Siemens Calibre 3DSTACK, validated with Intel Foveros Direct technology.

User2User North America

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Intel: PDN analysis for advanced packages

Sadha Parasurman, Intel

Siemens EDA: Unified PDN analysis for advanced 2.5D/3D packaging. Model consistency, comprehensive DC, AC, and transient droop analysis across silicon and package domains.

User2User North America

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NCAB: UHDI PCBs vs. IC substrates in advanced packaging

Hüseyin Anac, Ncab Group Germany GmbH

Hybrid packaging solutions: Substrate-Like PCBs. Clarifying functional/structural distinctions and technological overlap between UHDI PCBs and IC substrates for advanced packaging.

User2User Europe

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TSMC: Chiplet solutions for automotive ADAS & AV

Alexey Tsvetkov, TSMC

TSMC's auto-grade advanced nodes for ADAS/AI. Explore higher infotainment integration & modular SoC architectures with chiplets, shaping future mobility & intelligence.

User2User Europe

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Voxel: AI mixed-signal verification for 3D sensors

G Vermont & JS Staelens, Voxel Sensors

Verify 3D-stacked SPAD image sensors! Explore a custom design flow using Siemens Questa, Symphony, & SDE. Discover a multi-modal verification approach, leveraging digital checks & Python scripting for complex 3D architectures.

User2User Europe

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Hyundai: Data-driven PHM for automotive electronics

SW Eo & S Moon, Hyundai Motors

Optimize SDV verification! Learn how PHM data from in-vehicle operations refines criteria in automated systems. Move beyond worst-case assumptions for efficient, high-performance automotive electronics.

User2User Europe

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Swissbit: Chiplet design for automotive reliability

Jens Weis, Swissbit Germany AG

Uncover chiplet test vehicle insights! See Swissbit's journey in the CeCaS project, from concept and Xpedition design to overcoming assembly hurdles and valuable lessons learned during demonstrator test.

User2User Europe

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Fraunhofer: Chiplets in Europe: Trends and challenges

Andy Heinig, Fraunhofer

Explore practical integration solutions for automotive, defense, & industrial sectors. Discover how organic interposers & cost-effective interconnects balance performance, reliability, & integration density.

User2User Europe