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User2User North America 2026

Technical training

Santa Clara, CA | Santa Clara Marriott 
Wednesday, April 29, 2026

Join us for User2User and extend your experience with expert-led training sessions the following day.

Training overview

We are excited to offer a unique training opportunity the day after User2User North America!

With nearly 40 years of experience in their fields, our training experts will help you learn new tips, increase your productivity with Siemens EDA tools, and steer you toward earning a digital badge certification.

Each three-hour lecture will deliver curated material from our most sought-after courses in a condensed format. Every participant will take home a free on-demand training subscription* for the full, self-paced training course, so you can expand your knowledge and perform hands-on labs in our virtual cloud-enabled environment (up to a $2,500 value.)

To sign up for this training opportunity, you may add one or both during registration. Spaces are limited so act fast.

Cost: $350 - A limited number of promo codes are available, so contact your Siemens EDA account manager for more information.

  • 9 a.m. – noon - Layout analysis with advanced Calibre features
  • 1 p.m. – 4 p.m. - Overview - Tessent Diagnosis Driven Yield Analysis
An instructor teaches a technical training course to attendees at the Siemens User2User conference.

Technical trainers

Layout analysis with advanced Calibre features

Calibre is widely recognized for physical design verification in IC design, utilizing foundry PDKs for DRC, LVS, PERC, XRC, and related checks. Beyond verification, Calibre also enables physical design analysis, delivering critical insights to optimize circuit performance. This three-hour technical session will explore decoupling capacitor analysis, its impact on high-frequency chip designs, and how Calibre helps identify non-physical limitations through advanced design analysis.

Who should attend

The intended audience is circuit and physical design engineers interested in improving chip performance for high-frequency applications.

This training session will include a high-level view of:

  • Calibre Rule Writing for DRC and LVS
  • Calibre Mastering eqDRC
  • Analyzing physical design with Calibre DESIGNrev and RVE

Overview - Tessent Diagnosis Driven Yield Analysis

Understanding the root causes of SoC test and field return failures is critical for yield and reliability. This three-hour technical session provides an overview of the Tessent Diagnosis Driven Yield Analysis flow using Tessent Diagnosis and Tessent YieldInsight tools.

Who Should Attend

The intended audience is design, DFT, test, and product engineers working within corporate yield enhancement and reliability framework.

  • Get an understanding of how manufacturing test data of failing devices can be made actionable for PFA
  • Learn how Tessent Diagnosis identifies and qualifies logic and test failures using layout information
  • Gain a basic understanding of the difference between fault models and defects
  • Learn how Tessent Diagnosis supports yield analysis
  • Learn about signature analysis of production volume failure data
  • Learn how Tessent YieldInsight’s proprietary Root Cause Deconvolution statistical algorithm identifies the most probable root cause of a failure

* Siemens EDA Learning Services offers a free on-demand training (ODT) subscription for those who register and attend both the User2User conference and a Technical Training session. The subscription is valid for one year and valued at $2,500. This offer cannot be combined with other promotions, and no exceptions or substitutions will be made.

* If a promotional code is applied, the discount shall be valid for one class only.

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