User2User gives Siemens EDA users a dynamic space to learn, connect, and grow. Join expert-led sessions, exchange real-world insights, and build meaningful relationships across the EDA community.
At User2User 2026, we’re introducing dynamic horizontal themes that cut across traditional vertical product tracks. In addition to focused sessions on Siemens EDA solutions, attendees will find thought-provoking content woven throughout the agenda on four key innovation areas.
3D ICs bring complex die-to-die interactions and stacking configurations that traditional 2D SoC workflows can’t capture. Learn how design teams use system-driven approaches and unified flows to achieve predictable PPA.
Unlock everything you need to become a better user — dive into sessions, tools and insights designed to elevate your skills and expertise.
3D ICs bring complex die-to-die interactions and stacking configurations that traditional 2D SoC workflows can’t capture. Learn how design teams use system-driven approaches and unified flows to achieve predictable PPA.
Learn how users leverage Solido's AI-powered solutions for custom IC design, simulation, library characterization and IP validation to optimize quality, improve productivity and accelerate time-to-market.
Learn how Questa One users automate simulation and formal verification, regressions, debugging and coverage closure of complex systems-on-a-chip, 3DICs, and FPGAs to increase productivity and better manage resources.
Veloce hardware-assisted verification platforms for emulation, enterprise prototyping and software prototyping enable the use of shift-left strategies to accelerate system-on-chip hardware and software verification and validation.
Explore how C-to-RTL-to-GDS design, implementation, and analysis solutions from Siemens enable design teams to accelerate design schedules, while achieving power, performance, timing, and area targets.
Explore how expanding Calibre into Implementation, using Calibre cloud computing, and adopting our new AI-assisted debug methodologies improve your workflow by enhancing collaboration and shortening your turnaround time.
Today's electronics engineers face new challenges. Join peers to explore innovative solutions in electronic systems design, data management, collaboration, co-design, supply chain resilience and performance verification.
Discover how Solido's AI-powered solutions streamline silicon IP validation and characterization, enabling faster sign-off, higher quality designs and improved productivity across your workflow.
New solutions based on packetized data delivery are changing DFT applications in broader solutions. Applications include analog test, DFT and system health across the silicon lifecycle.