Siemens EDA
TSMC OIP Ecosystem Forum 2022 (Virtual)
Available online to event registrants beginning November 10, for 6 months.
View informative presentations from our industry experts. Visit our partner booth to learn how Siemens EDA can help you engineer a smarter future faster.
Siemens EDA is a platinum sponsor!
TSMC continually develops pioneering silicon processes that enable many of the world’s most advanced ICs. Siemens is proud to collaborate with TSMC to continue to provide the difference-making technologies that enable our mutual customers to deliver their IC innovations to market more quickly, with confidence in their quality and performance.
Siemens EDA Papers & Presentations
SerDes clocking catered to robust noise handling in advanced process technologies for HPC, Datacenter, 5G and AI applications
HPC & 3DIC Topics
Presented by Danfeng Xu, et al. (eTopus Technologies) & Pradeep Thiagarajan (Siemens EDA)
Advanced assembly verification for TSMC 3DFabric™ packages
HPC & 3DIC Topics
Presented by Sudersan Sampath (Broadcom) & Mike Walsh (Siemens EDA)
Low-power, high-density design implementation for AI chip
Mobile & Automotive Topics
Presented by Elyasaf Munk (Hailo Technologies) & Venkat Rao (Siemens EDA)
TSMC, Microsoft Azure, and Siemens EDA collaboration - enabling your jump to N3E using the cloud and Calibre nmDRC
HPC & 3DIC Topics
Presented by Andy Chan (Microsoft) & Michael White (Siemens EDA)
TSMC 3Dblox™ simplifies Calibre verification and analysis
HPC & 3DIC Topics
Presented by John Ferguson (Siemens EDA)