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TSMC OIP Ecosystem Forum 2023

Join us September 27th, 2023 at the Santa Clara Convention Center.

View informative presentations from our industry experts and visit our partner booth to learn how Siemens EDA can help you engineer a smarter future faster.

platinum sponsor

Come see us in Santa Clara at booth #416!

TSMC continually develops pioneering silicon processes that enable many of the world’s most advanced ICs. Siemens is proud to collaborate with TSMC to continue to provide the difference-making technologies that enable our mutual customers to deliver their IC innovations to market more quickly, with confidence in their quality and performance.

Image of booth at TSMC event

Siemens EDA Papers & Presentations

High Voltage (>10V) RF and Analog Interfaces for Standard Low Voltage CMOS TSMC Processes

IoT, RF & Other Track

11:30 – 12:00

Presented by Stephen Fairbanks (Certus Semiconductor) & Pradeep Thiagarajan (Siemens EDA)

3DIC test challenges and DFT development experience with Tessent Multi-die

HPC & 3DFabric Track

13:00 – 13:30

Presented by Saket Kumar Goyal (Broadcom) & Jan Tofte (Siemens EDA)

Attacking resistance, the key limiter in achieving EMIR clean results, with layout modifications

Mobile and Automotive Track

16:30 – 17:00

Presented by Yen-Min Tsai (MediaTek) & Jeff Wilson (Siemens EDA)

AWS and Siemens EDA Collaborate to Accelerate Your Migration to the Cloud

Mobile and Automotive Track

17:00 – 17:30

Presented by Azim Siddique (AWS) & Christopher Clee (Siemens EDA)

Silicon Photonics Verification: Siemens -TSMC successful collaboration

Online Only

Presented by Basma Serry (Siemens EDA)

Automatic ESD risk analysis and reliability enhancement

Online Only

Presented by Yi-Ting Lee, Jimmy Tien, Jeff Wilson (Siemens EDA)