Siemens EDA
TSMC OIP Ecosystem Forum 2023
Join us September 27th, 2023 at the Santa Clara Convention Center.
View informative presentations from our industry experts and visit our partner booth to learn how Siemens EDA can help you engineer a smarter future faster.
Come see us in Santa Clara at booth #416!
TSMC continually develops pioneering silicon processes that enable many of the world’s most advanced ICs. Siemens is proud to collaborate with TSMC to continue to provide the difference-making technologies that enable our mutual customers to deliver their IC innovations to market more quickly, with confidence in their quality and performance.
Siemens EDA Papers & Presentations
High Voltage (>10V) RF and Analog Interfaces for Standard Low Voltage CMOS TSMC Processes
IoT, RF & Other Track
11:30 – 12:00
Presented by Stephen Fairbanks (Certus Semiconductor) & Pradeep Thiagarajan (Siemens EDA)
3DIC test challenges and DFT development experience with Tessent Multi-die
HPC & 3DFabric Track
13:00 – 13:30
Presented by Saket Kumar Goyal (Broadcom) & Jan Tofte (Siemens EDA)
Attacking resistance, the key limiter in achieving EMIR clean results, with layout modifications
Mobile and Automotive Track
16:30 – 17:00
Presented by Yen-Min Tsai (MediaTek) & Jeff Wilson (Siemens EDA)
AWS and Siemens EDA Collaborate to Accelerate Your Migration to the Cloud
Mobile and Automotive Track
17:00 – 17:30
Presented by Azim Siddique (AWS) & Christopher Clee (Siemens EDA)
Silicon Photonics Verification: Siemens -TSMC successful collaboration
Online Only
Presented by Basma Serry (Siemens EDA)
Automatic ESD risk analysis and reliability enhancement
Online Only
Presented by Yi-Ting Lee, Jimmy Tien, Jeff Wilson (Siemens EDA)