TSMC continually develops pioneering silicon processes that enable many of the world’s most advanced ICs. Siemens is proud to collaborate with TSMC to continue to provide the difference-making technologies that enable our mutual customers to deliver their IC innovations to market more quickly, with confidence in their quality and performance.
HPC & 3DIC Topics
Presented by Danfeng Xu, et al. (eTopus Technologies) & Pradeep Thiagarajan (Siemens EDA)
HPC & 3DIC Topics
Presented by Sudersan Sampath (Broadcom) & Mike Walsh (Siemens EDA)
Mobile & Automotive Topics
Presented by Elyasaf Munk (Hailo Technologies) & Venkat Rao (Siemens EDA)
HPC & 3DIC Topics
Presented by Andy Chan (Microsoft) & Michael White (Siemens EDA)
HPC & 3DIC Topics
Presented by John Ferguson (Siemens EDA)