Siemens EDA
TSMC OIP Ecosystem Forum 2024
Join us September 25th, 2024 at the Santa Clara Convention Center.
View informative presentations from our industry experts and visit our partner booth to learn how Siemens EDA can help you engineer a smarter future faster.
Come see us in Santa Clara at booth #516!
TSMC continually develops pioneering silicon processes that enable many of the world’s most advanced ICs. Siemens is proud to collaborate with TSMC to continue to provide the difference-making technologies that enable our mutual customers to deliver their IC innovations to market more quickly, with confidence in their quality and performance.
Siemens EDA Papers & Presentations - North America
Automotive, IoT, & RF Track
11:30 – 11:50
Presented by Dr. Meng-Yi Wu, R&D Director, eMemory Technology
Automotive, IoT, & RF Track
13:30 – 13:50
Presented by Martin Sanchez, Principal Silicon IP Quality Lead, Microsoft
HPC & Mobile Track
13:30 – 13:50
Presented by Mohamed Atoua, Product Manager, Solido Design Environment, Siemens EDA & Anoop Gopinath, Senior Design Engineer, NVIDIA
HPC & Mobile Track
13:50 – 14:10
Presented by Christopher Clee, Product Engineer, Siemens EDA & Azim Siddique, Principal Solutions Architect, AWS Cloud
Automotive, IoT, & RF Track
14:10 – 14:30
Presented by Joseph Davis, Sr. Director of Product Management, Siemens EDA
HPC & Mobile Track
14:50 – 15:10
Presented by Mike Walsh, Technical Director – IC Packaging Solutions, Siemens EDA & Amit Kumar, Principal Engineering Manager, Microsoft
HPC & Mobile Track
15:30 – 15:50
Presented by Mike Kang, Systems CAD Director, Microsoft Azure Silicon, Microsoft & Gaurav Deshpande, Sr. Applications Engineer, Technical Sales-NA, Siemens EDA
HPC & Mobile Track
16:10 – 16:30
Presented by David Abercrombie, Product Management Director, Siemens EDA
Automotive, IoT, & RF Track
Online only
Presented by Lih-Jen Hou, Technical Product Manager, Siemens EDA & Tomohiro Ishida, Design Engineer, THine Electronics
Automotive, IoT, & RF Track
Online Only
Presented by Ray Valencia, Product Manager, Siemens EDA
Siemens EDA Papers & Presentations - Japan
Automotive, IoT, & RF Track
12:10 – 12:30
Presented by Hsiao-Wei Su, Foundry Lead, Calibre Foundry Program, Siemens EDA
Automotive, IoT, & RF Track
13:50 – 14:10
Presented by Daniel Blakely, Senior Application Consultant, Siemens EDA
Automotive, IoT, & RF Track
15:40 – 16:00
Presented by Yuling Lin, Account Technology Manager, Siemens EDA and Tomohiro Ishida, Design Engineer, THine Electronics
Automotive, IoT, & RF Track
Online Only
Presented by Aravind Radhakrishnan Nair, Principal Engineer, Infineon Technologies and Ray Valencia, Product Manager, Siemens EDA
Automotive, IoT, & RF Track
Online Only
Presented by Bart Keppens, Chief Business Development, SOFICS
Automotive, IoT, & RF Track
Online Only
Presented by Dr. Meng-Yi Wu, R&D Director, eMemory Technology
HPC & 3DFabric Track
Online Only
Presented by Anshuman Chandra, Lead R&D for 3D/2.5D Devices, Siemens EDA
Siemens EDA Papers & Presentations - Taiwan
Mobile, IoT & Automotive Track
11:30 – 11:50
Presented by Hsiao-Wei Su, Foundry Lead, Calibre Foundry Program, Siemens EDA
Mobile, IoT & Automotive Track
11:50 – 12:10
Presented by Dr. Meng-Yi Wu, R&D Director, eMemory Technology
Mobile, IoT & Automotive Track
12:10 – 12:30
Presented by J.J. Yu, Manager of Calibre Foundry Program, Siemens EDA
Mobile, IoT & Automotive Track
13:30 – 13:50
Presented by Sathishkumar Balasubramanian, Head of Product Management, Custom IC, Siemens EDA
Mobile, IoT & Automotive Track
15:20 – 15:40
Presented by Anshuman Chandra, Lead R&D for 3D/2.5D Devices, Siemens EDA
HPC & 3DFabric Track
15:40 – 16:00
Presented by Daniel Blakely, Senior Application Consultant, Siemens EDA
Mobile, IoT & Automotive Track
Online Only
Presented by Derong Yan, Principal Product Engineer, Siemens EDA and Azim Siddique, Principal Solutions Architect, AWS Cloud
Mobile, IoT & Automotive Track
Online Only
Presented by Aravind Radhakrishnan Nair, Principal Engineer, Infineon Technologies and Ray Valencia, Product Manager, Siemens EDA
HPC & 3DFabric Track
Online Only
Presented by Vivek Chickermane, Sr. Director of R&D, Tessent Embedded Analytics, Siemens EDA
Siemens EDA Papers & Presentations - China
Mobile, IoT & Automotive Track
11:35 – 11:55
Presented by Daniel Blakely, Senior Application Consultant, Siemens EDA
Mobile, IoT & Automotive Track
14:10 – 14:30
Presented by Binson Chen, Sr. Foundry Engineering Manager, Calibre Design Solutions, Siemens EDA
Mobile, IoT & Automotive Track
Online only
Presented by Aravind Radhakrishnan Nair, Principal Engineer, Infineon Technologies and Ray Valencia, Product Manager, Custom IC, Siemens EDA
Mobile, IoT & Automotive Track
Online only
Presented by Lih-Jen Hou, Product Manager, Custom IC, Siemens EDA and Tomohiro Ishida, Design Engineer, THine Electronics
Mobile, IoT & Automotive Track
Online only
Presented by Aravind Radhakrishnan Nair, Principal Engineer, Infineon Technologies and Ray Valencia, Product Manager, Custom IC, Siemens EDA
Mobile, IoT & Automotive Track
Online only
Presented by Dr. Meng-Yi Wu, R&D Director, eMemory Technology
HPC & 3DFabric Track
Online only
Presented by Anshuman Chandra, Lead R&D for 3D/2.5D Devices, Siemens EDA
Siemens EDA Papers & Presentations - Europe
HPC & Mobile Track
12:10 – 12:30
Presented by Lionel Couder, Senior Application Engineering Consultant, Siemens EDA
HPC & Mobile Track
13:50 – 14:10
Presented by Karim El-Sabry, Application Engineer, Siemens EDA
HPC & Mobile Track
14:10 – 14:30
Presented by Dr. Meng-Yi Wu, R&D Director, eMemory Technology
HPC & Mobile Track
Online only
Presented by Derong Yan, Principal Product Engineer, Calibre Design Solutions, Siemens EDA and Azim Siddique, Principal Solutions Architect, AWS Cloud
HPC & Mobile Track
Online only
Presented by David Abercrombie, Product Management Director, Calibre Design Solutions, Siemens EDA
Automotive, IoT & RF Track
12:10 – 12:30
Presented by Aravind Radhakrishnan Nair, Principal Engineer, Infineon Technologies and Ajay Kumar, Senior Applications Engineer, Siemens EDA
Automotive, IoT & RF Track
14:10 – 14:30
Presented by Alexandre Arriordaz, Product Engineering Director, Calibre Design Solutions, Siemens EDA
Automotive, IoT & RF Track
15:20 – 15:40
Presented by Aravind Radhakrishnan Nair, Principal Engineer, Infineon Technologies and Ajay Kumar, Senior Applications Engineer, Siemens EDA
Automotive, IoT & RF Track
Online only
Presented by Bart Keppens, Chief Business Development, SOFICS