Charting the path to More Moore (GAA and More Moore)
Introduction of DTCO collaboration and DM technology from Samsung and its partners!
Participants: Siemens/Qualcomm, Ansys, Cadence, Synopsys
The New Era: We’re Building a Cube, not a Chip (Multi-Die Integration)
Introduction of design flow and methodology for overcoming 3DIC design challenges in multi-die system design.
Participants: Siemens, Ankor Technology, Cadence, Synopsys
Tom Williams, Mask Layout Designer and Technical Lead, Qualcomm
Srinivas Velivala, Principal Product Manager, Calibre Design Solutions, Siemens EDA
Dusan Petranovic, Principal Technologist, Calibre Design Solutions, Siemens EDA
Jeff Wilson, Product Management Director, Calibre Design Solutions, Siemens EDA
Matthew Hogan, Product Management Director, Calibre Design Solutions, Siemens EDA
Lee Harrison, Automotive IC Test Solutions Manager, Tessent, Siemens EDA
Wei-Lii Tan, Principal Product Manager, Analog Mixed Signal, Siemens EDA
Swathi Rangarajan, Aprisa Product Manager, Siemens EDA
Srigiripura Sripada, Aprisa Product Engineer, Siemens EDA