Siemens EDA
Join Siemens at Samsung SAFE and Foundry Forum 2022
Available online on-demand October 21 - December 31, 2022
Watch our informative presentations to learn how Siemens EDA can help you engineer a smarter future faster...
Tech Session 1
Charting the path to More Moore (GAA and More Moore)
Introduction of DTCO collaboration and DM technology from Samsung and its partners!
Participants: Siemens/Qualcomm, Ansys, Cadence, Synopsys
Tech Session 2
The New Era: We’re Building a Cube, not a Chip (Multi-Die Integration)
Introduction of design flow and methodology for overcoming 3DIC design challenges in multi-die system design.
Participants: Siemens, Ankor Technology, Cadence, Synopsys
Siemens EDA presentations
Accelerate DRC closure for custom designs by 2-5X – Qualcomm’s experience with Calibre RealTime Custom
Tom Williams, Mask Layout Designer and Technical Lead, Qualcomm
Srinivas Velivala, Principal Product Manager, Calibre Design Solutions, Siemens EDA
Challenges and solutions in parasitic extraction of heterogeneous integrated systems
Dusan Petranovic, Principal Technologist, Calibre Design Solutions, Siemens EDA
Addressing IR-drop issues with analysis-driven, DRC-aware via layout modifications
Jeff Wilson, Product Management Director, Calibre Design Solutions, Siemens EDA
Full-chip Calibre PERC checks: Development, optimization and automation
Matthew Hogan, Product Management Director, Calibre Design Solutions, Siemens EDA
Improving test quality and reliability via in-system/in-field testing
Lee Harrison, Automotive IC Test Solutions Manager, Tessent, Siemens EDA
Using machine learning methods for brute-force accurate high-sigma standard cell verification
Wei-Lii Tan, Principal Product Manager, Analog Mixed Signal, Siemens EDA
Design implementation with Aprisa for Samsung’s advanced technologies
Swathi Rangarajan, Aprisa Product Manager, Siemens EDA
Srigiripura Sripada, Aprisa Product Engineer, Siemens EDA