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Siemens EDA

Join Siemens at Samsung SAFE and Foundry Forum 2022

Available online on-demand October 21 - December 31, 2022

Watch our informative presentations to learn how Siemens EDA can help you engineer a smarter future faster...

Siemens EDA

Tech Session 1

Charting the path to More Moore (GAA and More Moore)

Introduction of DTCO collaboration and DM technology from Samsung and its partners!

Participants: Siemens/Qualcomm, Ansys, Cadence, Synopsys

illustrations of finFET and GAAFET devices next to each other
Siemens EDA

Tech Session 2

The New Era: We’re Building a Cube, not a Chip (Multi-Die Integration)

Introduction of design flow and methodology for overcoming 3D IC design challenges in multi-die system design.

Participants: Siemens, Ankor Technology, Cadence, Synopsys

illustration of a cube IC

Siemens EDA presentations

Tom Williams, Mask Layout Designer and Technical Lead, Qualcomm
Srinivas Velivala, Principal Product Manager, Calibre Design Solutions, Siemens EDA

Dusan Petranovic, Principal Technologist, Calibre Design Solutions, Siemens EDA

Jeff Wilson, Product Management Director, Calibre Design Solutions, Siemens EDA

Matthew Hogan, Product Management Director, Calibre Design Solutions, Siemens EDA

Lee Harrison, Automotive IC Test Solutions Manager, Tessent, Siemens EDA

Wei-Lii Tan, Principal Product Manager, Analog Mixed Signal, Siemens EDA

Swathi Rangarajan, Aprisa Product Manager, Siemens EDA
Srigiripura Sripada, Aprisa Product Engineer, Siemens EDA