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Siemens EDA at GOMACTech

March 9-12, 2026 | New Orleans, LA

Gold Sponsor

Join Siemens EDA at GOMACTech 2026

Siemens empowers defense innovation through advanced digitalization. Join our experts to discover solutions that accelerate your mission, from AI-powered design to comprehensive digital twins.

Two computer processors are shown against a dark blue background. The left is a physical component with gold pins visible on its underside. The processor on the right is a digital twin, showing its internal circuitry.

Engineer a smarter future, faster - booth #120

Siemens software allows you to develop more cost-effective electronic systems, components, and products.

Software defined

Hardware abstraction is now essential - explore and validate software before expensive silicon commits in an era where design mistakes cost millions.

AI powered

Close the widening productivity gap as AI-chip complexity explodes - human designers need AI augmentation to keep pace with exponential design challenges.

Silicon enabled

Next-generation applications demand flawless execution - nanometer-level precision engineering is no longer optional but critical for competitive survival.

Expert sessions

Presentations you won't want to miss! Stop by meeting room 272 to hear insights from industry experts.

Select...
  • 12:00pm - 12:20pm - Redefine 3D IC performance for AI — with AI

  • 1:00pm - 1:20pm - MBSE

  • 2:00pm - 2:20pm - EBS

  • 3:00pm - 3:20pm - Redesigning Chip Design with Generative and Agentic AI using Fuse EDA AI System

  • 4:00pm - 4:20pm - DVT

  • 5:00pm - 5:20pm - Veloce

Siemens EDA papers and presentations

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  • 1:30pm - 3:10pm | Room 293
    Systematic PDN analysis for Advanced Packaging Architectures
    Contributors: Siemens - John Caka, Muhammed Hassan, Sudarshan Deo | Intel -Satish Surana, Sadha Parasuraman

  • 1:30pm - 3:10pm | Room 295
    Verification Coverage Traceability for System to Silicon via Verification Capture Points (VCPs)
    Contributors: Siemens - Mike Andrews, Ahmed Hamza

    Executable Digital Twin of a Tera-Op Signal Chain
    Contributors: Siemens - Nilay Mitash, Jeff Laster | Raytheon Technologies - PC Chien, Muru Ramaswami, Davin Swanson, Sean Lee, Kayla May, Jackson Chia, Ken Johnson

    Emulation Isn’t Just for ASICs
    Contributors: Siemens - Mark Baker | Collins Aerospace - Gregory Allen