We are excited to showcase our software-defined, AI-powered and 3D IC solutions at DAC 2026. These technologies are reshaping the semiconductor industry.
Our speakers will present our software-defined, AI-powered, 3D IC and connected verification and validation solutions.
Continue the conversation with focused sessions and workshops, including:
Calibre intelligence across the verification flow, shows how Siemens’ Fuse AI combines GenAI and ML to improve semiconductor verification with tools like Doc Assistants, LSG Copilot, Run Advisor, Check Assist, and Vision AI.
The advent of Agentic AI brings opportunities to EDA. This workshop explores Aprisa AI and Siemens Fuse orchestrate AI agents for RTL-to-GDS flows to accelerate closure, improve QoR, and enable autonomous design implementation.
Chip design complexity is growing. This session explores how Siemens EDA's agentic AI-driven HPC Works platform helps teams upskill faster, design smarter and cut tape-out times with intelligent compute.
In this session, discover how Solido AI is powering the next wave of Custom IC innovation with faster engines, smarter execution, trusted outcomes and significant productivity gains across your workflows.
The session covers system-level verification challenges across power, performance, and DFT, and how pre-silicon digital twin platforms help teams identify issues earlier and deliver more robust software-defined systems.
Agentic AI systems reason, plan, adapt, and accelerate workflows, uniting isolated EDA tools into collaborative, context-aware partners, giving rise to the D&V Scientist:engineer orchestrating intelligence across the full flow.
Industrial-grade and purpose-built for semiconductor, 3D IC and PCB design
AI-driven heterogeneous integration. Chiplet to system
Emulation and Prototyping at the heart of SW-HW verification at scale
Hear from real customer journeys that are tackling the toughest challenges in modern industry.
Missed a session or want to revisit your favorites? We’ve got you covered. Browse our library of recorded sessions and catch up on all the insights at your own pace.
We are turning to AI to accelerate. This TechTalk explores how purpose-built AI & GenAI platforms are transforming EDA workflows—while addressing the unique challenges of quality, data, & scalability that define chip development.
Our panel discusses the key hurdles in adapting mainstream AI technologies to EDA, including tool integration, domain-specific fine-tuning, and ensuring "industrial-grade" reliability.
Our session explores AI methods in the digital design creation flow. During the session we will show how AI is revolutionizing digital flows today, and how we can further leverage this exciting technology going forward.
Our session explores how scalable, intelligent verification strategies are addressing these challenges through connected workflows, AI-enhanced automation, and data-driven insights.
Our panel aims to bring together experts to discuss and explore solutions for overcoming the challenges associated with Software-Defined-Systems electronics development.
Our panel examines the application domains poised to benefit most from 3D IC technologies and identifies the technical, economic, and ecosystem barriers impeding widespread adoption.
Our session explores the concept of the Semiconductor Digital Thread—a holistic, integrated approach to managing the complete semiconductor lifecycle in the era of software-defined design.
