The pace of innovation in electronics is constantly accelerating. To enable customers to deliver life-changing innovations faster and become market leaders, Siemens EDA is committed to delivering the world’s most comprehensive portfolio of electronic design automation (EDA) software, hardware, and services.
Monday, June 24
11:15 a.m. - noon PDT
DAC Pavilion, Level 2 Exhibit Hall
Bridging the Gaps in Engineering Software for Semiconductors and Systems
Siemens DISW will join Jay Vleeschhouwer, Research Analyst of Griffin Securities, will discuss trends in EDA with other senior executives from leading industrial software companies.
Panelist Speaker: Tony Hemmelgarn, CEO, Siemens Digital Industries Software
A New Frontier for Floorplanning with AI
Accelerating IO Liberty Generation through ML based Solution
AI-Assisted Design Optimization for Extensive Design Spaces: Handling 260,000+ Combinations
AI-based High Sigma Verification Methodology for Multiple PVT Corners
AI-Powered High-Sigma Automated Full Library Verification Methodology for Standard Cells
An efficient QA methodology for SRAM libraries
Autonomous Power Sequence validation solution for I/O using Solido Design Environment
Best of Both Worlds: Bridging the Gaps in Engineering Software for Semiconductors and Systems
Bus Delay Skew Minimization for High Bandwidth Memory Designs
Critical corners selection for standard cells LVF characterization using AI
Design Automation Advancement in the Analog Domain
Empowering CDC analysis methodology with root cause analysis
Evaluating power, performance, and area for standard cell libraries from different IP providers
High Coverage QA for Process Variability Compensation in LVS Rule Deck
Implementing World's First Fully Integrated SoC Solution For Direct-To-Satellite IoT Connectivity
Parasitic Leakage Detection in Layout Design
Peak Power Optimization using Active Datapath Operator Profiling
Pruning Netlist: A Smarter Approach to Efficient and Reliable Circuit Characterization
Resolving the seed promotion due to device layers derivation
Samsung's IP QA methodology using Solido Crosscheck
Solving the antenna debug challenge in physical design verification
The Designer's Superpower! Early Circuit Verification with Calibre nmLVS Recon
What is the Future of Design Verification? UVM, PSS, Formal, VIP, AI & Beyond