Thank you for joining us at Chiplet Summit 2026!
Explore our on-demand resources to see how Siemens' AI-powered, unified 3D IC solutions reduce risks and enable first-pass silicon success.
Thank you for joining us at Chiplet Summit
This year's summit brought innovation, collaboration, and a big win!
Highlights:
- Keynote: "Redefine 3D IC performance for AI - with AI" by Juan Rey
- Theatre sessions: Industry partners fostered 3D IC ecosystem collaboration
- Technical leadership through presentations & papers
- Live booth demonstrations of end-to-end workflows
- Innovator3D IC won Best of Show in "Packaging: Design"
Watch the sessions on-demand
Explore the on-demand library of recorded demos to revisit key insights anytime, at your own pace. Looking for something more tailored? Request a customized demo and connect directly with Siemens 3D IC tech experts.
Advanced 3D IC multiphysics design
Learn how unified multiphysics flows from Siemens provide early system-level insights, enabling faster, more predictable 3D IC success.
3D assembly verification
Learn how to verify heterogenous systems and accelerate LVS/DRC debugging in a unified design environment.
Integrated die-to-system thermal modeling
See how Siemens enables a seamless thermal analysis flow to accelerate design closure while improving system reliability.
Solutions showcased at Chiplet Summit
Attendees experienced how we redefine the 3D IC development cycle, exploring our unified 3D IC workflow in action.
Unified, AI-driven 3D IC solutions
Siemens unified, AI-driven 3D IC solutions integrate planning, analysis, signoff and testing to deliver true system technology co-optimization (STCO).
Predictive multiphysics analysis
Integrated thermal, mechanical and electrical modeling from die to system levels to identify reliability risks early.
Holistic UCIe-based flow
Complete 64G UCIe design flow featuring Alphawave Semi’s IP and Siemens' integrated design tools from pre-layout analysis through final signoff.
More info
Discover how Siemens' end-to-end 3D IC solutions help customers achieve first-pass design success.