Siemens EDA at Chiplet Summit
Join us at Chiplet Summit, Feb. 17-19, 2026, at the Santa Clara Convention Center.
Visit us at Booth #200
Explore AI-driven 3D IC solutions. See live end-to-end workflow demos and hear from Intel, Fraunhofer, Arm experts, and discuss 2026 priorities with our team.
Don't miss our keynote
Feb. 18 | 11:30 a.m. - Noon
Redefine 3D IC performance for AI — with AI
Hear Juan Rey, SVP and GM, Calibre, Siemens EDA, on AI's role in three-dimensional integrated circuit (3D IC) design strategies.
Redefine 3D IC development cycle at booth #200
Explore the Siemens unified 3D IC workflow in action. Unlock faster and more power, performance and area (PPA) convergence.
Unified, AI-driven 3D IC solutions
Discover how Siemens unified, AI-driven 3D IC solutions integrate planning, analysis, signoff and testing to deliver true system technology co-optimization (STCO).
Predictive multiphysics analysis
Explore integrated thermal, mechanical and electrical modeling from die to system levels to identify reliability risks early.
Holistic UCIe-based flow
See the complete 64G Universal Chiplet Interconnect Express (UCIe) using Alphawave Semi's IP, from pre-route modeling to final post-layout compliance.
Siemens EDA papers and presentations
Request a meeting
We look forward to connecting with you at Chiplet Summit. Please use this form to request a meeting with the Siemens team onsite.