{"breadcrumbs":[],"image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/6fdJ8XV36q29Ns2lBj7zYi/en-US/RealizeLIVE_U2U_2021-2668x1500_OriginalUpdate.png?w=1920&q=60","image_alt":"Events-RL+U2U-2021-UdpatedHero","logo":"//images.ctfassets.net/17si5cpawjzf/3y80vnJEmKyNOuLpN0mwiz/e4718c74aaca3b2e58bce0d052f6cfba/Trimmed_RealizeLIVE_U2U_Logo.png","logo_alt":"RealizeLive and U2U 2021","rotatingText":["today","manufacturing","engineering","design"],"staticTextStart":"Where","staticTextEnd":"meets tomorrow.","overlay":true,"height":400,"description":""}
Where today meets tomorrow.
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SIEMENS EDA EXPERIENCE

IC Design, Implementation, Verification and Packaging

<p>Explore Calibre and Aprisa: Calibre delivers a complete IC verification and DFM platform that speeds designs from creation, packaging to manufacturing. Aprisa place-and-route is our new route-centric physical design platform.</p>
MUST WATCH SESSIONS!

Expert Speakers @ Realize LIVE + U2U 2021

Experience a variety of customer testimonials and in-depth technical pieces exploring Calibre and Aprisa. Here is a selection of some of our expert presenters. To see the full lineup, click below to explore the agenda and mark your favorites @ Realize LIVE + U2U 2021.

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MEET THE EXPERT

Calibre® PERC™ Packaged Checks

<p>Discover how you can meet your reliability requirements using configurable, easy-to-use, pre-coded Calibre® PERC™ Packaged Checks for Circuit Topology, ESD, EOS, Design Verification &amp; Analog Layout Verification. Join our experts for a live interactive session to find out more!</p>

MEET THE EXPERT

How to Shrink P&R Design Cycle by Weeks

<p>Are you facing with increasing complexities require significant engineering effort and longer turn-around time to close your SOC designs? Meet our experts to learn how Aprisa can help you accelerate your design closure!</p>

SESSION

A New Methodology to Enhance the IC Packaging Planning

<p>Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.</p>

ic packaging, an image of a chip in the center of a computer motherboard

Calibre Blog

Design with Calibre Blog

<p>Learn about new Calibre products, advancements in technology and updates in existing tools at the Design with Calibre blog site</p>

How to Videos

IC Nanometer Design YouTube Channel

<p>View 100’s of 3-5 minute how-to videos highlighting key functionalities.</p>

EDA INSIGHTS WITH JOE SAWICKI

Silicon to Systems: from Vision to Reality

<p>Semiconductor innovation is fueling digitalization as SoCs become ever more complex hardware and software systems. To thrive requires a visionary approach, in a semiconductor industry primed to surpass a trillion dollars in revenue by 2030. Joe Sawicki, EVP IC, Siemens EDA, shares how three tenets of technology, design, and system scaling, on a foundation of AI, help you engineer a smarter future faster.</br></br> </p>

PORTFOLIO

Xcelerator – Embrace the Digital Future

<p>Our comprehensive and integrated portfolio of software and services for electronic and mechanical design, system simulation, manufacturing, operations and lifecycle analytics.</p>

Xcelerator